Modular I/O Systems (LioN-Link)

Modular, dezentralized IP67 I/O System for field level applications


LioN-Link is a modular, decentralized IP67 I/O system for field level applications and is used in situations where machines or plants have distributed I/O concentrations in limited space conditions.

LioN-Link consists of bus couplers and I/O modules. The bus couplers are used for linking the I/O modules to the Fieldbuses. Starting from the bus coupler, the I/O modules divide up decentrally in the field via two strands. This ensures same system structure for different Fieldbuses.

  • Maximum flexibility in planning and modifications during commissioning and retrofitting, thanks to universal I/O functionality.
  • Easy, fast and secure installation thanks to the staggered arrangement of the ports and the optimized distance between individual ports. The modules are designed both for the rear and for the side installation and can even be mounted directly on the profile rails.
  • All LioN-Link modules can be used directly in the field level close to the process and are optimally suited for use in the smallest handling robots.
  • Digital and analog modules: DI, DO, DIDO, DIO, AI I, AI U
  • 4-, 8- and 16-was I/O design
  • Bus couplers for CANopen, DeviceNet, Interbus, Profibus, Profinet & EtherNet/IP
  • Two Lines per bus coupler
  • Up to 15 devices per line (max. 480 I/Os per coupler)
  • Each line with 100 m extensions
  • Input modules are supplied using the LioN-Link connection
  • M8 or M12 connections
  • Ambient temperature: -10 bis +60 °C
  • Protection degree: IP 67
  • Plastic (PBT) housing
  • Cycle time appox. 2 ms

For use in harsh industrial environments - the IP67 modules offer features such as metal housings, complete encapsulation, vibration and shock resistance and meet all relevant standards:

  • Factory Automation
  • Mechanical Engineering
  • Material Handling
  • Packaging and Food Applications

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